We follow a structured, verification-driven hardware development workflow that ensures every design is electrically sound, layout-optimized, and validated for real-world deployment.
Our schematic development is driven by a methodical, constraint-aware engineering process, ensuring that the design is electrically correct, scalable, and layout-ready from the outset.
Define project structure, libraries, naming conventions, and version control baseline. This ensures traceability and consistency across the design lifecycle.
Use verified symbols from controlled libraries or create new ones with strict pin mapping validation. Library integrity is maintained to avoid downstream mismatches.
Assign footprints, annotate designators, and validate symbol-to-footprint linkage. This step ensures seamless transition into PCB layout without ambiguity.
Implement circuit connectivity with clear hierarchy, net labeling, and organized signal flow for maximum readability.
Define global and local nets with proper naming conventions. Critical nets (power, clocks, high-speed lines) are explicitly controlled for layout intent.
Run systematic ERC to detect connectivity issues, missing drivers, pin conflicts, and logical inconsistencies. All violations are resolved or formally justified.
Embed engineering notes, assumptions, and constraints directly into the schematic. Internal review checkpoints ensure design completeness before layout handoff.
A fully validated, layout-ready schematic with aligned libraries, clean connectivity, and zero ambiguity for PCB implementation.
We execute PCB design with a focus on signal integrity, power integrity, EMI/EMC performance, and manufacturability. Every board is engineered to perform reliably in real-world conditions—not just in CAD.
Import schematic, define board stack-up, layer configuration, and design rules aligned with fabrication capabilities and electrical requirements.
Establish mechanical outline, mounting constraints, keep-outs, and interface locations. Electrical constraints such as impedance, clearance, and creepage are defined upfront.
Verify footprints against datasheets and manufacturing tolerances. Placement strategy is planned based on functional blocks, signal flow, and thermal behaviour.
Controlled impedance for high-speed lines, short return paths and proper grounding, separation of noisy and sensitive domains, and current-carrying trace sizing based on load.
Add clear component markings, polarity indicators, and assembly references to support manufacturing and debugging.
Run comprehensive DRC covering spacing, width, via constraints, and fabrication limits. All violations are resolved with manufacturability in mind.
Export Gerber/ODB++, drill files, pick-and-place, and assembly drawings. Outputs are validated for fabrication and assembly readiness.
This phase ensures that the design transitions from theory to verified, field-ready hardware through structured validation and iterative refinement.

Coordinate with fabrication and assembly vendors. Validate fabrication outputs, BOM alignment, and component availability.

Ensure assembly quality through visual inspection, polarity checks, solder integrity, and critical component verification.

Execute controlled power-up sequence including power rail validation, current consumption checks, interface initialization, and clock/signal verification.

Validate system behaviour against design intent across peripheral functionality, signal integrity, thermal performance, and load testing.

Identify design gaps, implement corrective actions, and refine the design. Changes are tracked and validated systematically.

Perform final validation against requirements, including edge cases and operating limits.

Freeze design for manufacturing with validated documentation, ensuring smooth transition to volume production.